Patent Assignment
Reel/Frame 022818/0816
Assignment of Assignor's Interest
Recorded: 2009-06-12
Pages: 2
Assignee
PHOENIX PRECISION TECHNOLOGY CORPORATION
NO. 6, LI-HSIN ROAD,, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, TAIWAN
Covered Property
(1)
Packaging Substrate Having Embedded Semiconductor Chip and Fabrication Method Thereof
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.