Merger

Recorded: 2011-05-27 Pages: 3

Assignor

Executed: 2010-01-13

Assignee

UNIMICRON TECHNOLOGY CORP.

NO. 38, HSING PONG RD., KWEI SAN INDUSTRIAL ZONE, TAOYUAN, TAIWAN

Covered Property (1)

Packaging Substrate Having Embedded Semiconductor Chip and Fabrication Method Thereof

Patent: 7,973,397 →

Application: 12/483,528 →

Publication: US 2009/0309202

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.