IP Library Assignment 022855/0032
Patent Assignment
Reel/Frame 022855/0032

Assignment of Assignor's Interest

Recorded: 2009-06-22 Pages: 3
Assignor
BLANCHARD, PIERRE
Executed: 2009-06-22
Assignee
E2V SEMICONDUCTORS
AVENUE DE ROCHEPLEINE, SAINT EGREVE, 38120, FRANCE
Covered Property (1)
Connection Pad Structure for an Image Sensor on a Thinned Substrate
Patent: 8,105,917 →
Application: 12/518,030 →
Publication: US 2010/0314776
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name Mar 2, 2018
From: E2V SEMICONDUCTORS
To: TELEDYNE E2V SEMICONDUCTORS SAS
Reel/Frame 045651/0012 →