Patent Assignment
Reel/Frame 045651/0012
Change of Name
Recorded: 2018-03-02
Pages: 4
Assignor
E2V SEMICONDUCTORS
Executed: 2017-04-21
Assignee
TELEDYNE E2V SEMICONDUCTORS SAS
AVENUE DE ROCHEPLEINE, SAINT-ÉGRÈVE, 38120, FRANCE
Covered Properties
(42)
Image Sensor Having Linear Abutting Bars
Process for the Collective Fabrication of Microstructures Consisting of Superposed Elements
Differential Transistor Pair Current Switch Supplied by a Low Voltage Vcc
Electronic Network Circuit with Dissymmetrical Differential Pairs
Image Sensor with Corner Cuts
Thinned Image Sensor with Trench-Insulated Contact Terminals
Color Image Sensor with Improved Optical Crosstalk
Intra-Oral Dental-Image Sensor System with Multiple Leds
Circuit for Clock Extraction from a Binary Data Sequence
Connection Pad Structure for an Image Sensor on a Thinned Substrate
Process for Fabricating a High-Integration-Density Image Sensor
Integrated Circuit Package, Notably for Image Sensor, and Method of Positioning
Sampler Blocker Protected Against Switching Parasites
Method for Attaching a Cable to the Housing of an Electronic Circuit
Dental Radiology Image Sensor with Soft Overmodling
Method of Reading an Image Sensor Signal and Image Sensor
High-Speed Analog-Digital Converter Having a Signal Folding Structure Improved by Reducing the Number of Elementary Cells
INTEGRATED CIRCUIT ARRAY HAVING COLUMN CONDUCTORS EACH ASSOCIATED WITH A RESPECTIVE BASIC READ CIRCUIT, AND IN PARTICULAR A LARGE-SIZED IMAGE SENSOR (As amended)
Electron Multiplication Image Sensor and Corresponding Method
Charge-Integration Multilinear Image Sensor
Image Sensor with Double Integration Time and Conditional Selection
Electron-Multiplication Image Sensor
Image Sensor with Very High Dynamic Range
Multilinear Image Sensor with Charge Integration
Swipe Linear Image Sensor with Analog and Digital Summation and Corresponding Method
Image Sensor Having a Sampler Array
Matrix Charge-Transfer Image Sensor with Asymmetric Gate
Two-Line, Shared Pixel Linear Image Sensor
Pixel-Grouping Image Sensor
Digital-To-Analogue Converter
Moving Image Sensor Having Multiphase Digital Summation and Charge Storage Nodes Separated from Photodiodes by Charge Transfer Gates (as Amended)
Matrix Image Sensor Providing Bidirectional Charge Transfer with Asymmetric Gates
Image-Sensing Method Having a Very Short Integration Time
Method for Producing Images with Depth Information and Image Sensor
Time Delay Integration Image Sensor with Detection of Travelling Errors
Image Sensor with Anti-Blooming Gate
Ramp-Type Analogue-Digital Conversion, with Multiple Conversions or Single Conversion, Depending on the Light Level Received by a Pixel
Image Sensor with Control Signal Sequence Generation
Silicon-Based Image Sensor with Improved Reading Dynamic Range
Method for Capturing an Image with Dark Current Reduction and Low Power Consumption
Time Delay Integration Image Capture Method Correcting Image Defects Caused by Cosmic Particles
Method and System for Taking Medical Radiology Images with Control of the Stopping of the X-Ray Source
Related Assignments
(20)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
May 1, 2006
From: LIGOZAT, THIERRY; GILI, BRUNO
To: ATMEL GRENOBLE
Reel/Frame 017879/0144 →
Assignment of Assignor's Interest
Jun 26, 2007
From: ROMMEVEAUX, PHILIPPE; ASPAR, BERNARD
To: E2V SEMICONDUCTORS; TRACIT TECHNOLOGIES
Reel/Frame 019479/0846 →
Assignment of Assignor's Interest
Mar 14, 2008
From: BORE, FRANCOIS; BRUEL, SANDRINE; WINGENDER, MARC
To: E2V SEMICONDUCTORS
Reel/Frame 020652/0196 →
Assignment of Assignor's Interest
Jul 9, 2008
From: LIGOZAT, THIERRY; CHENEBAUX, GREGOIRE
To: E2V SEMICONDUCTORS
Reel/Frame 021213/0305 →
Assignment of Assignor's Interest
Jul 24, 2008
From: MORISSON, RICJHARD
To: E2V SEMICONDUCTORS
Reel/Frame 021320/0770 →
Re-Record to Correct the Name of the Assignor, Previously Recorded on Reel 021320 Frame 0770.
Aug 11, 2008
From: MORISSON, RICHARD
To: E2V SEMICONDUCTORS
Reel/Frame 021376/0919 →
Assignment of Assignor's Interest
Nov 24, 2008
From: BLANCHARD, PIERRE
To: E2V SEMICONDUCTORS
Reel/Frame 021880/0144 →
Assignment of Assignor's Interest
Apr 21, 2009
From: FEREYRE, PIERRE
To: E2V SEMICONDUCTORS
Reel/Frame 022570/0710 →
Assignment of Assignor's Interest
May 15, 2009
From: AYRAUD, MICHEL
To: E2V SEMICONDUCTORS
Reel/Frame 022688/0373 →
Assignment of Assignor's Interest
May 28, 2009
From: AYRAUD, MICHEL
To: E2V SEMICONDUCTORS
Reel/Frame 022749/0659 →
Assignment of Assignor's Interest
Jun 22, 2009
From: BLANCHARD, PIERRE
To: E2V SEMICONDUCTORS
Reel/Frame 022855/0032 →
Assignment of Assignor's Interest
Jun 23, 2009
From: POURQUIER, ERIC
To: E2V SEMICONDUCTORS
Reel/Frame 022861/0398 →
Assignment of Assignor's Interest
Sep 14, 2009
From: SIMON, GILLES
To: E2V SEMICONDUCTORS
Reel/Frame 023224/0952 →
Assignment of Assignor's Interest
Sep 18, 2009
From: MORISSON, RICHARD
To: E2V SEMICONDUCTORS
Reel/Frame 023251/0635 →
Assignment of Assignor's Interest
Oct 30, 2009
From: GUICHARD, JEROME; JULIEN, FLORIAN
To: E2V SEMICONDUCTORS
Reel/Frame 023446/0707 →
Assignment of Assignor's Interest
Dec 1, 2009
From: GIRARD, FREDERIC
To: E2V SEMICONDUCTORS
Reel/Frame 023583/0585 →
Change of Name
Jan 13, 2010
From: ATMEL GRENOBLE
To: E2V SEMICONDUCTORS
Reel/Frame 023776/0721 →
Assignment of Assignor's Interest
Mar 31, 2010
From: LEBOULEUX, NICOLAS; LIGOZAT, THIERRY
To: E2V SEMICONDUCTORS
Reel/Frame 024165/0283 →
Assignment of Assignor's Interest
Oct 19, 2010
From: TRACIT TECHNOLOGIES
To: S.O.I. TEC SILICON ON INSULATOR TECHNOLOGIES
Reel/Frame 025150/0678 →
Assignment of Assignor's Interest
Oct 25, 2010
From: BRUEL, SANDRINE; BORE, FRANCOIS
To: E2V SEMICONDUCTORS
Reel/Frame 025188/0257 →