Integrated circuit array having column conductors each associated with a respective basic read circuit, and in particular a large-sized image sensor
The invention relates notably to large-sized image sensors or image sensors with a large number of rows. Each column of pixels is organized in P superposed blocks. A row decoder organized as P identical decoders selects one row out of M in each of the P blocks. Each block is linked to one respective column conductor out of P column conductors. P read circuits CL 1 to CL 4 are placed at the foot of each column of pixels and each is connected to a respective column conductor. The signals from the P rows selected by the decoder can be extracted simultaneously or else they can be selected by a specific decoder which selects one read circuit out of the P read circuits of each column. The matrix can be produced by photolithography, by abutting identical matrix portions, for example P different portions corresponding to P identical regions ZB 1 to ZB 4 .
1. An integrated circuit comprising a set of basic circuits, all identical, arranged in X rows and Y columns, each row of basic circuits being addressed by a row conductor linked to a row decoder, wherein each column of basic circuits is subdivided into P blocks, P being greater than 2, of basic circuits, and wherein there are provided, for each column, P juxtaposed basic read circuits, placed at one and the same end of this column and each associated with a respective block, and P column conductors each associated with a respective basic read circuit and a respective block, a column conductor being linked to the associated basic read circuit and to all the basic circuits of the associated block but not to the basic circuits of the other blocks.
2. The integrated circuit as claimed in claim 1 , wherein the blocks of basic circuits are juxtaposed between a top and a bottom of the matrix.
3. The integrated circuit as claimed in claim 1 , wherein the basic read circuits associated with a column are placed side by side in line.
4. The integrated circuit as claimed in claim 1 , wherein each of the P blocks comprises P conductor sections extending between the top and the bottom of the block, the geometrical arrangement of the conductor sections of a block being identical to that of the other blocks, each column conductor comprising P conductor sections which are connected end-to-end and which are each taken in a respective block.
5. The integrated circuit as claimed in claim 1 , wherein the P conductor sections of a block are arranged on two different metallization levels, P- 1 sections being produced on one of the levels and a last section using the second level to intersect the P- 1 first sections.
6. The integrated circuit as claimed in claim 1 , wherein the P conductor sections of a block, juxtaposed and arranged in a rank from 1 to P, each comprise a bottom end and a top end positioned so that the bottom end of a section of a given rank situated in a first block comes into contact with the top end of a section of another rank situated in a second block placed above the first block.
7. The integrated circuit as claimed in claim 6 , wherein the connection between the conductor sections of two adjacent blocks is made according to a circular permutation of the ranks of the sections, a section of a first rank of a first block coming into contact with a section of a second rank of the other block, and so on.
8. The integrated circuit as claimed in claim 1 , wherein the basic circuits of the matrix are photosensitive pixels, the integrated circuit being a matrix image sensor.
9. The integrated circuit as claimed in claim 2 , wherein the basic read circuits associated with a column are placed side by side in line.
10. The integrated circuit as claimed in claim 2 , wherein each of the P blocks comprises P conductor sections extending between the top and the bottom of the block, the geometrical arrangement of the conductor sections of a block being identical to that of the other blocks, each column conductor comprising P conductor sections which are placed end-to-end and which are each taken in a respective block.
11. The integrated circuit as claimed in claim 3 , wherein each of the P blocks comprises P conductor sections extending between the top and the bottom of the block, the geometrical arrangement of the conductor sections of a block being identical to that of the other blocks, each column conductor comprising P conductor sections which are placed end-to-end and which are each taken in a respective block.
12. The integrated circuit as claimed in claim 2 , wherein the P conductor sections of a block are arranged on two different metallization levels, P- 1 sections being produced on one of the levels and a last section using the second level to intersect the P- 1 first sections.
13. The integrated circuit as claimed in claim 3 , wherein the P conductor sections of a block are arranged on two different metallization levels, P- 1 sections being produced on one of the levels and a last section using the second level to intersect the P- 1 first sections.
14. The integrated circuit as claimed in claim 4 , wherein the P conductor sections of a block are arranged on two different metallization levels, P- 1 sections being produced on one of the levels and a last section using the second level to intersect the P- 1 first sections.
15. The integrated circuit as claimed in claim 2 , wherein the P conductor sections of a block, juxtaposed and arranged in a rank from 1 to P, each comprise a bottom end and a top end positioned so that the bottom end of a section of a given rank situated in a first block comes into contact with the top end of a section of another rank situated in a second block placed above the first.
16. The integrated circuit as claimed in claim 3 , wherein the P conductor sections of a block, juxtaposed and arranged in a rank from 1 to P, each comprise a bottom end and a top end positioned so that the bottom end of a section of a given rank situated in a first block comes into contact with the top end of a section of another rank situated in a second block placed above the first.
17. The integrated circuit as claimed in claim 4 , wherein the P conductor sections of a block, juxtaposed and arranged in a rank from 1 to P, each comprise a bottom end and a top end positioned so that the bottom end of a section of a given rank situated in a first block comes into contact with the top end of a section of another rank situated in a second block placed above the first.
18. The integrated circuit as claimed in claim 5 , wherein the P conductor sections of a block, juxtaposed and arranged in a rank from 1 to P, each comprise a bottom end and a top end positioned so that the bottom end of a section of a given rank situated in a first block comes into contact with the top end of a section of another rank situated in a second block placed above the first.
19. The integrated circuit as claimed in claim 2 , wherein the basic circuits of the matrix are photosensitive pixels, the integrated circuit being a matrix image sensor.
20. The integrated circuit as claimed in claim 3 , wherein the basic circuits of the matrix are photosensitive pixels, the integrated circuit being a matrix image sensor.