Patent Assignment
Reel/Frame 022889/0720
Assignment of Assignor's Interest
Recorded: 2009-06-29
Pages: 5
Assignors
HOHLFELDER, TADD
Executed: 2009-06-29
MORAN, BRAD
Executed: 2009-06-26
MATTHEWS, RUBIN
Executed: 2009-06-26
GANNON, THOMAS
Executed: 2009-06-29
Assignee
TTM TECHNOLOGIES, INC.
2630 SOUTH HARBOR BOULEVARD, SANTA ANA, CALIFORNIA, 92704
Covered Property
(1)
System for Filling Holes in a Printed Circuit Board with a Fluid Fill Material
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Patent Security Agreement-Term
Jun 8, 2015
From: TTM TECHNOLOGIES, INC.; VIASYSTEMS, INC.; VIASYSTEMS TECHNOLOGIES CORP., L.L.C.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 035851/0928 →
Patent Security Agreement-Abl
Jun 8, 2015
From: TTM TECHNOLOGIES, INC.; VIASYSTEMS, INC.; VIASYSTEMS TECHNOLOGIES CORP., L.L.C.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 035858/0890 →
Release of Security Interest in Patents Previously Recorded at Reel/Frame (035858/0890)
Jun 2, 2026
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: TTM TECHNOLOGIES, INC. (FORMERLY KNOWN AS VIASYSTEMS GROUP, INC. AND VIASYSTEMS, INC.); TTM TECHNOLOGIES NORTH AMERICA, LLC (FORMERLY KNOWN AS VIASYSTEMS TECHNOLOGIES CORP., L.L.C.)
Reel/Frame 075681/0922 →