Patent Assignment
Reel/Frame 022893/0021
Assignment of Assignor's Interest
Recorded: 2009-06-30
Pages: 2
Assignor
GALLEGOS, BERNARDO
Executed: 2009-05-29
Assignee
TEXAS INSTRUMENTS INCORPORATED
7839 CHURCHILL WAY, MS 3999, DALLAS, TEXAS, U.S.A. 75265
Covered Property
(1)
Flip Chip Semiconductor Device Having Workpiece Adhesion Promoter Layer for Improved Underfill Adhesion