Patent Assignment
Reel/Frame 022903/0184
Assignment of Assignor's Interest
Recorded: 2009-07-01
Pages: 4
Assignors
MURAI, HIDEYA
Executed: 2009-05-18
KAYASHIMA, YUJI
Executed: 2009-05-18
MAEDA, TAKEHIKO
Executed: 2009-05-18
YAMAMICHI, SHINTARO
Executed: 2009-05-18
FUNAYA, TAKUO
Executed: 2009-05-18
Assignees
NEC CORPORATION
7-1, SHIBA 5-CHOME, MINATO-KU, TOKYO, 108-8001, JAPAN
NEC ELECTRONICS CORPORATION
1753, SHIMONUMABE, NAKAHARA-KU, KAWASAKI-SHI, KANAGAWA, 211-8668, JAPAN
Covered Property
(1)
Semiconductor Device Including an Lsi Chip and a Method for Manufacturing the Same
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.