Patent Assignment
Reel/Frame 022938/0745
Assignment of Assignor's Interest
Recorded: 2009-07-10
Pages: 3
Assignors
NAGAYA, FUSAJI
Executed: 2009-07-06
KURODA, NOBUHISA
Executed: 2009-07-06
AWANO, ATSUSHI
Executed: 2009-07-06
Assignee
IBIDEN CO., LTD.
1, KANDACHO 2-CHOME, OGAKI-SHI, GIFU, 503-0917, JAPAN
Covered Property
(1)
Wiring Substrate and Method for Manufacturing the Same