Wiring substrate and method for manufacturing the same
A method for manufacturing a wiring substrate includes forming a conductor circuit on an insulating layer, the conductor circuit including a pad, a circuit pattern connected to the pad, and a lead pattern connected to the pad. A solder resist layer is formed on the circuit pattern and on the insulating layer, and a plating resist layer is formed on the lead pattern and on the insulating layer and forming a metal film on a first portion of the conductor circuit not covered by the solder resist layer and not covered by the plating resist layer. The plating resist layer is removed to expose a second portion of the conductor circuit adjacent to the first portion of the conductor circuit and not covered with the metal film, and an etching resist layer is formed on the metal film and on the second portion of the conductor circuit. A third portion of the conductor circuit not covered by the etching resist layer is removed by etching, and the etching resist is removed. The conductor circuit covered with the etching resist layer is a part of the second portion of the conductor circuit exposed by removing the plating resist.
1. A wiring substrate comprising:
an insulation layer;
a pad formed on the insulation layer and having a first end and a second end opposite to the first end;
a circuit pattern connected to the first end of the pad;
a conductor connected to the second end of the pad;
a solder resist layer formed on the circuit pattern and on the insulation layer; and
a metal film formed on the pad and on a part of the conductor,
wherein a surface of the conductor comprises a first portion not covered by the metal film, a second portion of the conductor covered by the metal film and connected to the second end of the pad, and wherein the first portion of the conductor includes a terminal end of the conductor which is distal to the second portion of the conductor, said solder resist layer not formed on said terminal end.
2. The wiring substrate according to claim 1 , wherein the length of the first portion of the conductor is 5 to 40 μm.
3. The wiring substrate according to claim 1 , wherein a width of the pad is larger than a width of the circuit pattern.
4. The wiring substrate according to claim 1 , wherein a width of the pad is larger than a width of the conductor.
5. The wiring substrate according to claim 1 , wherein a width of the pad is larger than widths of each of the circuit pattern and the conductor.
6. The wiring substrate according to claim 1 , wherein a width of the conductor is smaller than the width of the pad.