Patent Assignment
Reel/Frame 022942/0594
Assignment of Assignor's Interest
Recorded: 2009-07-10
Pages: 4
Assignors
CHANG, HSIAO CHUAN
Executed: 2009-04-28
TSAI, TSUNG YUEH
Executed: 2009-04-28
LAI, YI SHAO
Executed: 2009-04-28
TONG, HO MING
Executed: 2009-04-28
CHEN, JIAN CHENG
Executed: 2009-04-28
YIH, WEI CHI
Executed: 2009-04-28
HUNG, CHANG YING
Executed: 2009-04-28
HSU, CHENG TSUNG
Executed: 2009-04-28
HUNG, CHIH CHENG
Executed: 2009-04-28
Assignee
ADVANCED SEMICONDUCTOR ENGINEERING, INC.
NO. 26, CHIN 3RD RD., NANTZE EXPORT PROCESSING ZONE, KAOHSIUNG, TAIWAN
Covered Property
(1)
Semiconductor Package and Method for Processing and Bonding a Wire