Patent Assignment
Reel/Frame 022984/0794
Assignment of Assignor's Interest
Recorded: 2009-07-14
Pages: 4
Assignors
CHOI, KYOUNG-SEI
Executed: 2009-07-02
KIM, BYUNG-SEO
Executed: 2009-07-06
JOO, YOUNG-JAE
Executed: 2009-07-06
CHUNG, YE-CHUNG
Executed: 2009-07-02
CHO, KYONG-SOON
Executed: 2009-07-02
LEE, SANG-HEUI
Executed: 2009-07-02
LEE, SI-HOON
Executed: 2009-07-02
KANG, SA-YOON
Executed: 2009-07-03
SON, DAE-WOO
Executed: 2009-07-02
JO, SANG-GUI
Executed: 2009-07-02
HA, JEONG-KYU
Executed: 2009-07-02
CHO, YOUNG-SANG
Executed: 2009-07-02
Assignee
SAMSUNG ELECTRONICS CO., LTD.
416 MAETAN-DONG, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Tape for Heat Dissipating Member, Chip on Film Type Semiconductor Package Including Heat Dissipating Member, and Electronic Apparatus Including the Same