Tape for heat dissipating member, chip on film type semiconductor package including heat dissipating member, and electronic apparatus including the same
Disclosed is a chip-on-film (COF) type semiconductor package and a device using the same. The COF type semiconductor package may include an insulation substrate including a top surface and bottom surface, a semiconductor device on the top surface of the insulation substrate, a heat dissipating component on the bottom surface of the insulation substrate, and at least one space between the bottom surface of the insulation substrate and a top surface of the heat dissipating component.
1. A COF (chip on film) type semiconductor package comprising:
an insulation substrate including a top surface and a bottom surface;
a semiconductor device on the top surface of the insulation substrate; and
a heat dissipating component on the bottom surface of the insulation substrate, wherein the heat dissipating component and the insulation substrate are arranged to form at least one space between the bottom surface of the insulation substrate and a top surface of the heat dissipating component.
2. The COF type semiconductor device of claim 1 , further comprising:
an adhesive component configured to attach the heat dissipating component to the bottom surface of the insulation substrate.
3. The COF type semiconductor device of claim 2 , wherein the at least one space is at least one pressure absorbing zone configured to absorb external pressure.
4. The COF type semiconductor device of claim 3 , wherein the at least one pressure absorbing zone is at a location corresponding to the heat dissipating component.
5. The COF type semiconductor device of claim 3 , wherein the at least one pressure absorbing zone is sealed by the insulation substrate, the heat dissipating component, and the adhesive component.
6. The COF type semiconductor device of claim 3 , wherein the at least one pressure absorbing zone is unsealed such that the pressure absorbing zone is connected to the outside.
7. The COF type semiconductor device of claim 3 , wherein at least one of a top surface and a bottom surface of the adhesive component includes at least one stepped portion and the at least one pressure absorbing zone corresponds to the at least one stepped portion.
8. The COF type semiconductor device of claim 7 , wherein the at least one stepped portion is adjacent the insulation substrate.
9. The COF type semiconductor device of claim 7 , wherein the at least one stepped portion is adjacent the heat dissipating component.
10. The COF type semiconductor device of claim 3 , wherein the top surface of the heat dissipating component includes at least one stepped portion and the at least one pressure absorbing zone corresponds to the at least one stepped portion.
11. The COF type semiconductor device of claim 3 , wherein the at least one pressure absorbing zone is between a top surface of the adhesive component and a bottom surface of the adhesive component.
12. The COF type semiconductor device of claim 3 , wherein the at least one pressure absorbing zone is between a top surface of the adhesive component and the bottom surface of the insulation substrate.
13. The COF type semiconductor device of claim 12 , wherein the adhesive component has a constant thickness.
14. The COF type semiconductor device of claim 13 , wherein the adhesive component directly contacts the bottom surface of the insulation substrate except for a portion of the adhesive component associated with the pressure absorbing zone.
15. The COF type semiconductor device of claim 3 , wherein a horizontal shape of the adhesive component and the heat dissipating component are the same.
16. The COF type semiconductor device of claim 3 , wherein the height of the at least one pressure absorbing zone is between about 50 nm and about 300 nm.
17. The COF type semiconductor device of claim 1 , wherein the insulation substrate is a flexible insulation substrate.
18. The COF type semiconductor device of claim 1 , wherein the thermal conductivity of the heat dissipating member is greater than the thermal conductivity of the insulation substrate.
19. The COF type semiconductor device of claim 1 , wherein the heat dissipating component includes protrusions configured to connect to a heat dissipating device.
20. A display device comprising:
the COF type semiconductor device of claim 1 .