Patent Assignment
Reel/Frame 022998/0801
Assignment of Assignor's Interest
Recorded: 2009-07-23
Pages: 6
Assignors
WANG, YE
Executed: 2009-07-15
LEE, SEUNGBAE
Executed: 2009-07-15
BHUGRA, HARMEET
Executed: 2009-07-15
Assignee
INTEGRATED DEVICE TECHNOLOGY, INC.
6024 SILVER CREEK VALLEY ROAD, SAN JOSE, CALIFORNIA, 95138
Covered Property
(1)
Thin-Film Bulk Acoustic Resonators Having Perforated Resonator Body Supports That Enhance Quality Factor
Patent:
8,106,724 →
Application:
12/508,257 →
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Agreement
Apr 5, 2017
From: INTEGRATED DEVICE TECHNOLOGY, INC.; GIGPEAK, INC.; MAGNUM SEMICONDUCTOR, INC.; ENDWAVE CORPORATION
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 042166/0431 →
Release of Security Interest
Mar 29, 2019
From: JPMORGAN CHASE BANK, N.A.
To: INTEGRATED DEVICE TECHNOLOGY, INC.; GIGPEAK, INC.; CHIPX, INCORPORATED; ENDWAVE CORPORATION
Reel/Frame 048746/0001 →