IP Library Granted Patent US 8,106,724
Granted Patent B1
US 8,106,724 · App. 12/508,257 · Granted Jan 31, 2012

Thin-film bulk acoustic resonators having perforated resonator body supports that enhance quality factor

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Quick Facts
Patent No.
US 8,106,724
App. No.
12/508,257
Granted
Jan 31, 2012
Kind
B1
Abstract

Micro-electromechanical acoustic resonators include a substrate having a cavity therein and a resonator body suspended over the cavity. The resonator body is anchored on opposing sides thereof (by support beams) to first and second portions of the substrate. These first and second portions of the substrate, which extend over the cavity as first and second ledges, respectively, each have at least one perforation therein disposed over the cavity. These perforations may be open or filled. The first and second ledges are formed of a first material (e.g., silicon) and the first and second ledges are filled with a second material having a relatively high acoustic impedance relative to the first material. This second material may include a material selected from a group consisting of tungsten (W), copper (Cu), molybdenum (Mo).

Claims (13)

1. A micro-electromechanical acoustic resonator, comprising:

a substrate having a cavity therein; and

a resonator body suspended over the cavity, said resonator body anchored on opposing sides thereof to first and second portions of said substrate that extend over the cavity as first and second ledges of a first material, respectively, said first and second ledges each having at least one perforation therein, which is disposed over the cavity and filled with a second material having a relatively high acoustic impedance relative to the first material.

2. The resonator of claim 1 , wherein the second material comprises a material selected from a group consisting of tungsten (W), copper (Cu), molybdenum (Mo).

3. The resonator of claim 1 , wherein said resonator body has a perforation therein disposed over the cavity.

4. The resonator of claim 3 , wherein a center of the perforation in said resonator body and centers of the perforations in the first and second ledges are collinear.

5. The resonator of claim 3 , wherein the perforation in said resonator body and respective perforations in the first and second ledges are aligned to a nodal line of said resonator body when said resonator body is operating at a resonant frequency.

6. The resonator of claim 1 , wherein said first and second ledges have first and second perforations therein, respectively; wherein the first and second perforations are aligned to a nodal line of said resonator body when said resonator body is operating at a resonant frequency; wherein a shape of the first perforation is symmetric about a first axis that is orthogonal to the nodal line and collinear with a centerline of the first perforation; and wherein a shape of the second perforation is symmetric about a second axis that is orthogonal to the nodal line and collinear with a centerline of the second perforation.

7. The resonator of claim 1 , wherein at least one of said first and second ledges has a plurality of perforations therein that are filled with the second material to thereby define alternating regions of unequal acoustic impedance within the at least one of said first and second ledges.

8. A micro-electromechanical acoustic resonator, comprising:

a substrate having a cavity therein; and

a resonator body suspended over the cavity, said resonator body anchored on opposing sides thereof to first and second portions of said substrate that extend over the cavity as first and second ledges of a first material, respectively, said first and second ledges each having at least one perforation therein, which is disposed over the cavity and filled with a second material having a different acoustic impedance relative to the first material.

9. The resonator of claim 8 , wherein at least one of said first and second ledges has a plurality of perforations therein that are filled with the second material to thereby define alternating regions of unequal acoustic impedance within the at least one of said first and second ledges.

Assignments (3)
RELEASE OF SECURITY INTEREST Recorded Mar 29, 2019
From: JPMORGAN CHASE BANK, N.A.
To: INTEGRATED DEVICE TECHNOLOGY, INC.; GIGPEAK, INC.; CHIPX, INCORPORATED; ENDWAVE CORPORATION; MAGNUM SEMICONDUCTOR, INC.
Reel/Frame 048746/0001 →
SECURITY AGREEMENT Recorded Apr 5, 2017
From: INTEGRATED DEVICE TECHNOLOGY, INC.; GIGPEAK, INC.; MAGNUM SEMICONDUCTOR, INC.; ENDWAVE CORPORATION; CHIPX, INCORPORATED
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 042166/0431 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 23, 2009
From: WANG, YE; LEE, SEUNGBAE; BHUGRA, HARMEET
To: INTEGRATED DEVICE TECHNOLOGY, INC.
Reel/Frame 022998/0801 →