Patent Assignment
Reel/Frame 023014/0987
Assignment of Assignor's Interest
Recorded: 2009-07-28
Pages: 3
Assignee
DSEM LED LIGHTING SDN. BHD.
PLOT 26, PHASE 4, FREE INDUSTRIAL ZONE, HILIR SUNGAI KELUANG 3, 11900 BAYAN LEPAS, PENANG, MALAYSIA
Covered Property
(1)
Diffusion Bonding Circuit Submount Directly to Vapor Chamber
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.