IP Library Assignment 023366/0388
Patent Assignment
Reel/Frame 023366/0388

Assignment of Assignor's Interest

Recorded: 2009-10-13 Pages: 2
Assignor
DSEM LED LIGHTING SDN. BHD.
Executed: 2009-09-30
Assignee
DSEM HOLDINGS SDN. BHD.
PLOT 26, PHASE 4, FREE INDUSTRIAL ZONE, HILIR SUNGAI KELUANG 3, BAYAN LEPAS, PENANG, 11900, MALAYSIA
Covered Property (1)
Diffusion Bonding Circuit Submount Directly to Vapor Chamber
Patent: 8,159,821 →
Application: 12/510,663 →
Publication: US 2011/0024086
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jul 28, 2009
From: TAN, KIA KUANG; TEOH, WAH SHENG
To: DSEM LED LIGHTING SDN. BHD.
Reel/Frame 023014/0987 →