Patent Assignment
Reel/Frame 023041/0389
Assignment of Assignor's Interest
Recorded: 2009-08-03
Pages: 3
Assignor
HU, CHUAN
Executed: 2009-06-15
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BLVD., SANTA CLARA, CALIFORNIA, 95052
Covered Property
(1)
Die-Warpage Compensation Structures for Thinned-Die Devices, and Methods of Assembling Same