IP Library › Assignment 023073/0357
Patent Assignment
Reel/Frame 023073/0357

Assignment of Assignor's Interest

Recorded: 2009-08-10 Pages: 5
Assignors
DING, XIAOYI
Executed: 2009-08-07
FRYE, JEFFREY J.
Executed: 2009-08-10
MILLER, GREGORY A.
Executed: 2009-08-07
Assignee
TEMIC AUTOMOTIVE OF NORTH AMERICA, INC.
21440 WEST LAKE COOK ROAD, 7TH FLOOR, PATENTS & LICENSES, DEER PARK, ILLINOIS, 60010
Covered Property (1)
Thin Semiconductor Device Having Embedded Die Support and Methods of Making the Same
Patent: 8,164,153 →
Application: 12/473,179 →
Publication: US 2010/0301431
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Merger Feb 27, 2012
From: TEMIC AUTOMOTIVE OF NORTH AMERICA, INC.
To: CONTINENTAL AUTOMOTIVE SYSTEMS, INC.
Reel/Frame 027766/0900 →
Assignment of Assignor's Interest Sep 15, 2021
From: CONTINENTAL AUTOMOTIVE SYSTEMS, INC.
To: VITESCO TECHNOLOGIES USA, LLC.
Reel/Frame 057650/0891 →