Patent Assignment
Reel/Frame 027766/0900
Merger
Recorded: 2012-02-27
Pages: 5
Assignor
TEMIC AUTOMOTIVE OF NORTH AMERICA, INC.
Executed: 2009-12-10
Assignee
CONTINENTAL AUTOMOTIVE SYSTEMS, INC.
ONE CONTINENTAL DRIVE, AUBURN HILLS, MICHIGAN, 48326
Covered Property
(1)
Thin Semiconductor Device Having Embedded Die Support and Methods of Making the Same
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Aug 10, 2009
From: DING, XIAOYI; FRYE, JEFFREY J.; MILLER, GREGORY A.
To: TEMIC AUTOMOTIVE OF NORTH AMERICA, INC.
Reel/Frame 023073/0357 →
Assignment of Assignor's Interest
Sep 15, 2021
From: CONTINENTAL AUTOMOTIVE SYSTEMS, INC.
To: VITESCO TECHNOLOGIES USA, LLC.
Reel/Frame 057650/0891 →