Patent Assignment
Reel/Frame 023139/0472
Assignment of Assignor's Interest
Recorded: 2009-08-24
Pages: 6
Assignors
GOTO, TAKAYUKI
Executed: 2009-06-29
UTSUMI, JUN
Executed: 2009-06-29
IDE, KENSUKE
Executed: 2009-06-29
TAKAGI, HIDEKI
Executed: 2009-06-29
FUNAYAMA, MASAHIRO
Executed: 2009-06-29
Assignees
MITSUBISHI HEAVY INDUSTRIES, LTD.
16-5, KONAN 2-CHOME, MINATO-KU, TOKYO, JAPAN
NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY
3-1, KASUMIGASEKI 1-CHOME, CHIYODA-KU, TOKYO, JAPAN
Covered Property
(1)
Room Temperature Bonding Using Sputtering
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.