Room temperature bonding using sputtering
A method of room-temperature bonding a plurality of substrates via an intermediate member, includes: forming the intermediate member on a surface to be bonded of the substrate by physically sputtering a plurality of targets; and activating the surface to be bonded by an ion beam. Preferably, the target composed of a plurality of types of materials is physically sputtered. Since the materials of the intermediate member are sputtered from the plurality of targets arranged in various directions from the surface to be bonded of the substrate, the intermediate member can be uniformly formed on the surface to be bonded. Further, since the intermediate member is composed of the plurality of types of materials, the room-temperature bonding of substrates difficult to bond together when an intermediate member is composed of a single type of material can be performed without heating and excessively pressing the substrates during bonding.
1. A method for room-temperature bonding a plurality of substrates via intermediate members, comprising:
providing said plurality of substrates, only a single physical sputtering source, and a plurality of targets such that said plurality of substrates is arranged at a position away from an axis line of said only a single physical sputtering source and at least one of said plurality of targets is arranged at a position away from said axis line, said axis line starting at a center of said only a single physical sputtering source and being parallel to a direction in which said only a single physical sputtering source faces, said axis line extending beyond said only a single physical sputtering source past said plurality of substrates and at least one of said plurality of targets;
forming said intermediate members on surfaces to be bonded of said plurality of substrates by physically sputtering said plurality of targets including the at least one said target arranged at a position away from said axis line using said only a single physical sputtering source;
activating said surfaces to be bonded of said plurality of substrates by physical sputtering using said only a single physical sputtering source; and
bonding said plurality of substrates.
2. A method for room-temperature bonding a plurality of substrates via intermediate members, comprising:
providing said plurality of substrates, only a single physical sputtering source, and a target composed of a plurality of types of materials such that said plurality of substrates is arranged at a position away from an axis line of said only a single physical sputtering source and said target is arranged at a position away from said axis line, said axis line starting at a center of said only a single physical sputtering source and being parallel to a direction in which said only a single physical sputtering source faces, said axis line extending beyond said only a single physical sputtering source past said plurality of substrates and said target;
forming said intermediate member on surfaces to be bonded of said plurality of substrates by physically sputtering said target using said only a single physical sputtering source;
activating said surfaces to be bonded of said plurality of substrates by physical sputtering using said only a single physical sputtering source; and
bonding said plurality of substrates.
3. The method for room-temperature bonding according to claim 1 or 2 , wherein said step of forming said intermediate members on said surfaces to be bonded of said substrate and said step of activating said surfaces to be bonded of said substrate are simultaneously performed.
4. The method for room-temperature bonding according to claim 2 , wherein said target includes a plurality of types of metals.
5. The method for room-temperature bonding according to claim 4 , wherein a composition ratio of said intermediate members is controlled by setting a component ratio of said plurality of types of metals.
6. The method for room-temperature bonding according to claim 2 , wherein said target is configured with a plurality of types of materials arranged to be independent of one another, and
wherein said plurality of types of materials is simultaneously sputtered.
7. The method for room-temperature bonding according to claim 6 , wherein when said plurality of types of materials is arranged on a target substrate, by setting an arrangement area ratio of said plurality of types of materials, a composition ratio of said intermediate members is controlled.
8. The method for room-temperature bonding according to claim 1 , wherein each of said plurality of targets includes a plurality of types of metals.
9. The method for room-temperature bonding according to claim 8 , wherein a composition ratio of said intermediate members is controlled by setting a component ratio of said plurality of metals.
10. The method for room-temperature bonding according to claim 1 , wherein each of said plurality of targets is configured with a plurality of types of materials arranged to be independent of one another, and
wherein said plurality of types of materials is simultaneously sputtered.
11. The method of room-temperature bonding according to claim 10 , wherein when said plurality of types of materials is arranged on a target substrate, by setting an arrangement area ratio of said plurality of types of materials, a composition ratio of said intermediate members is controlled.