IP Library Assignment 023143/0764
Patent Assignment
Reel/Frame 023143/0764

Assignment of Assignor's Interest

Recorded: 2009-08-25 Pages: 3
Assignors
AMANOKURA, JIN
Executed: 2009-04-22
SAKURADA, TAKAFUMI
Executed: 2009-04-27
ANZAI, SOU
Executed: 2009-04-23
SHINODA, TAKASHI
Executed: 2009-04-27
NOBE, SHIGERU
Executed: 2009-04-23
Assignee
HITACHI CHEMICAL CO., LTD.
1-1, NISHI-SHINJUKU 2-CHOME, SHINJUKU-KU, TOKYO, 163-0449, JAPAN
Covered Property (1)
Metal Polishing Slurry and Polishing Method
Patent: 8,821,750 →
Application: 12/527,607 →
Publication: US 2010/0120250
Related Assignments (4)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Address Jul 7, 2014
From: HITACHI CHEMICAL CO. LTD.
To: HITACHI CHEMICAL CO., LTD.
Reel/Frame 033279/0357 →
Change of Name Mar 2, 2023
From: HITACHI CHEMICAL COMPANY, LTD.
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 062917/0865 →
Change of Name Mar 3, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 062946/0125 →
Change of Address Feb 14, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066599/0037 →