IP Library › Assignment 023171/0278
Patent Assignment
Reel/Frame 023171/0278

Assignment of Assignor's Interest

Recorded: 2009-08-31 Pages: 5
Assignors
CHOI, YOON HYUCK
Executed: 2009-07-20
LEE, DAE HYEONG
Executed: 2009-07-20
KIM, JIN WAUN
Executed: 2009-07-20
OH, KWANG JAE
Executed: 2009-07-20
Assignee
SAMSUNG ELECTRO-MECHANICS CO., LTD.
314 MAETAN 3-DONG, YEONGTONG-GU, SUWON, GYUNGGI-DO, KOREA, REPUBLIC OF
Covered Property (1)
Circuit Board Module and Method of Manufacturing the Same
Patent: 8,330,049 →
Application: 12/550,812 →
Publication: US 2010/0252305
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Feb 13, 2017
From: SAMSUNG ELECTRO-MECHANICS CO., LTD.
To: SEMCNS CO., LTD.
Reel/Frame 041242/0295 →