Patent Assignment
Reel/Frame 041242/0295
Assignment of Assignor's Interest
Recorded: 2017-02-13
Pages: 5
Assignor
SAMSUNG ELECTRO-MECHANICS CO., LTD.
Executed: 2017-02-10
Assignee
SEMCNS CO., LTD.
1F, 35, PANGYO-RO, 255BEON-GIL, BUNDANG-GU, SEONGNAM-SI, GYEONGGI-DO, 13486, KOREA, REPUBLIC OF
Covered Properties
(12)
Laminated Ceramic Package
Multilayer Ceramic Substrate
Ceramic Laminate and Method of Manufacturing Ceramic Sintered Body
Circuit Board Module and Method of Manufacturing the Same
Method of Repairing a Probe Board
Method for Fabricating Ceramic Substrate
Thin Film Electrode Ceramic Substrate and Method for Manufacturing the Same
Pre Space Transformer, Space Transformer Manufactured Using the Pre Space Transformer, and Semiconductor Device Inspecting Apparatus Including the Space Transformer
Low Temperature Co-Fired Ceramic Substrate with Embeded Capacitors
Multilayer Ceramic Substrate and Manufacturing Thereof
Probe Card Having Lead Part for Removing Excessive Solder
Method of Manufacturing Multilayer Ceramic Electronic Component
Application:
14/981,650 →
Publication:
US 2016/0225524
Related Assignments
(12)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Dec 5, 2008
From: CHO, BEOM JOON; LEE, JONG MYEON
To: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Reel/Frame 021984/0724 →
Assignment of Assignor's Interest
May 18, 2009
From: PARK, YUN HWI; KIM, BONG GYUN; CHOI, YOON HYUCK
To: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Reel/Frame 022702/0242 →
Assignment of Assignor's Interest
Jul 27, 2009
From: LYOO, SOO HYUN; CHOI, YONG SEOK
To: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Reel/Frame 023011/0317 →
Assignment of Assignor's Interest
Aug 31, 2009
From: CHOI, YOON HYUCK; LEE, DAE HYEONG; KIM, JIN WAUN; OH, KWANG JAE
To: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Reel/Frame 023171/0278 →
Assignment of Assignor's Interest
Jan 10, 2011
From: CHANG, MYUNG WHUN; LEE, DAE HYEONG; HONG, KI PYO
To: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Reel/Frame 025611/0635 →
Assignment of Assignor's Interest
Feb 1, 2011
From: SUNG, JE HONG; CHOI, YOON HYUCK
To: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Reel/Frame 025727/0246 →
Assignment of Assignor's Interest
Jul 17, 2012
From: YOO, WON HEE; CHANG, BYEUNG GYU; LEE, TAEK JUNG; PARK, YUN HWI
To: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Reel/Frame 028665/0299 →
Assignment of Assignor's Interest
Sep 17, 2013
From: CHOI, YOON HYUCK; OH, KWANG JAE; KIM, KI YOUNG
To: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Reel/Frame 031226/0400 →
Assignment of Assignor's Interest
Apr 24, 2014
From: NA, JI-SUNG; CHO, BEOM-JOON; CHOI, JUNG-GOO; PARK, YUN-HWI
To: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Reel/Frame 032751/0079 →
Assignment of Assignor's Interest
Oct 19, 2015
From: LEE, TAEK JUNG; KIM, YONG SUK
To: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Reel/Frame 036825/0798 →
Assignment of Assignor's Interest
Nov 6, 2015
From: CHOI, YONG SEOK; CHUNG, DOO YUN; LEE, DAE HYEONG
To: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Reel/Frame 036980/0851 →
Assignment of Assignor's Interest
Dec 28, 2015
From: JOO, JIN KYUNG; LEE, BYOUNG HWA; KIM, TAE HO; KIM, DOO YOUNG
To: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Reel/Frame 037370/0193 →