Method for fabricating ceramic substrate
A method for fabricating a ceramic substrate includes: preparing a ceramic substrate; disposing a metal mask having a plurality of holes at an upper side of the ceramic substrate; and injecting a polyimide resin into the holes of the metal mask to form a polyimide thin film on the ceramic substrate. A thin film is formed on a ceramic substrate in a simpler manner, so the fabrication cost can be reduced and a fixed time can be shortened, thus increasing the efficiency of a product.
1. A method for fabricating a ceramic substrate, the method comprising steps of:
preparing a ceramic substrate;
preparing a metal mask having a plurality of holes;
disposing the metal mask at an upper side of the ceramic substrate;
injecting a polyimide resin through the plurality of holes of the metal mask onto the ceramic substrate; and
forming a polyimide thin film on the ceramic substrate with the injected polymide resin.
2. The method of claim 1 , wherein the polyimide resin is injected through the holes of the metal mask so as to be formed in the form of dots on the ceramic substrate.
3. The method of claim 1 , wherein, the step of forming the polyimide thin film includes the step of:
applying the polyimide resin to the ceramic substrate and leveling the polyimide resin to form the polyimide thin film.
4. The method of claim 1 , further comprising the step of:
polarizing the polyimide thin film through a mechanical method, a chemical method, or a mechanical and a chemical method.
5. The method of claim 1 , further comprising the step of:
adjusting the diameter of the holes of the metal mask to adjust the thickness of the polyimide thin film.
6. The method of claim 5 , wherein the diameter of each of the holes of the metal mask is 30 μm or larger.
7. The method of claim 1 , further comprising the step of:
adjusting the interval between the holes of the metal mask to adjust the thickness of the polyimide thin film.
8. The method of claim 7 , wherein the interval between the holes formed in the metal mask ranges from 30 μm to 500 μm.
9. The method of claim 5 , wherein the area of the holes of the metal mask is 80% or less of the entire area of the metal mask.
10. The method of claim 1 , wherein the polyimide resin has viscosity ranging from 10 3 cps to 10 5 cps.
11. The method of claim 1 , wherein the metal mask is formed of one or more of nickel (Ni) and silver (Ag).
12. The method of claim 1 , wherein the thickness of the polyimide thin film formed on the ceramic substrate ranges from 5 μm to 100 μm.
13. The method of claim 1 , further comprising the step of:
forming a via hole in the polyimide thin film, after forming the polyimide thin film.
14. The method of claim 13 , further comprising the step of:
forming an electrode pad on the via hole, after forming the via hole.