Patent Assignment
Reel/Frame 023199/0049
Assignment of Assignor's Interest
Recorded: 2009-09-07
Pages: 2
Assignor
CHIA, KAN-JUNG
Executed: 2009-08-26
Assignee
PHOENIX PRECISION TECHNOLOGY CORPORATION
NO. 6, LI-HSIN ROAD, SCIENCE-BASED INDUSTRIAL PARK, HSINCHU, TAIWAN
Covered Property
(1)
Package Substrate Having Semiconductor Component Embedded Therein and Fabrication Method Thereof
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.