Patent Assignment
Reel/Frame 023230/0190
Assignment of Assignor's Interest
Recorded: 2009-09-14
Pages: 3
Assignors
AIBA, AKIHIRO
Executed: 2004-01-30
OKABE, TAKEO
Executed: 2004-01-30
SEKIGUCHI, JUNNOSUKE
Executed: 2004-01-30
Assignee
NIKKO MATERIALS CO., LTD.
10-1, TORANOMON 2-CHOME, MINATO-KU, TOKYO, 105-8407, JAPAN
Covered Property
(1)
Electrolytic Copper Plating Method, Pure Copper Anode for Electrolytic Copper Plating, and Semiconductor Wafer Having Low Particle Adhesion Plated with Said Method and Anode
Related Assignments
(6)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name
Sep 16, 2009
From: NIKKO MATERIALS CO., LTD.
To: NIPPON MINING & METALS CO., LTD
Reel/Frame 023243/0104 →
Merger
Mar 1, 2017
From: NIPPON MINING & METALS CO., LTD.
To: NIPPON MINING HOLDINGS, INC.
Reel/Frame 041837/0464 →
Change of Address
Mar 1, 2017
From: JX NIPPON MINING & METALS CORPORATION
To: JX NIPPON MINING & METALS CORPORATION
Reel/Frame 041838/0863 →
Change of Name
Mar 1, 2017
From: NIPPON MINING HOLDINGS, INC.
To: JX NIPPON MINING & METALS CORPORATION
Reel/Frame 041952/0324 →
Change of Address
Mar 1, 2017
From: JX NIPPON MINING & METALS CORPORATION
To: JX NIPPON MINING & METALS CORPORATION
Reel/Frame 042104/0228 →
Change of Address
Aug 11, 2021
From: JX NIPPON MINING & METALS CORPORATION
To: JX NIPPON MINING & METALS CORPORATION
Reel/Frame 057160/0114 →