Assignment of Assignor's Interest

Recorded: 2009-09-24 Pages: 3

Assignor

LEE, SHENG-YUAN

Executed: 2009-09-21

Assignee

VIA TECHNOLOGIES, INC.

8F, NO. 535, CHUNG-CHENG RD., HSIN-TIEN CITY, TAIPEI HSIEN, R.O.C., TAIWAN

Covered Property (1)

Leadframe, Leadframe Type Package and Lead Lane

Patent: 8,084,848 →

Application: 12/566,056 →

Publication: US 2011/0001223

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.