IP Library › Assignment 052957/0092
Patent Assignment
Reel/Frame 052957/0092

Assignment of Assignor's Interest

Recorded: 2020-06-16 Pages: 4
Assignor
VIA TECHNOLOGIES, INC.
Executed: 2020-06-16
Assignee
VIA LABS, INC.
7F, 529-1, ZHONGZHENG RD., XINDIAN DIST.,, NEW TAIPEI CITY, 231, TAIWAN
Covered Properties (14)
Leadframe, Leadframe Type Package and Lead Lane
Patent: 8,084,848 →
Application: 12/566,056 →
Publication: US 2011/0001223
Leadframe, Leadframe Type Package and Lead Lane
Patent: 8,476,747 →
Application: 13/287,721 →
Publication: US 2012/0043651
Lead Arrangement, Electric Connector and Electric Assembly
Patent: 8,740,651 →
Application: 13/615,578 →
Publication: US 2013/0012067
Memory Controller
Patent: 9,116,825 →
Application: 13/910,138 →
Publication: US 2013/0332797
Transmission Circuit for I/O Interface and Signal Transmission Method Thereof
Patent: 9,215,111 →
Application: 14/020,903 →
Publication: US 2014/0086297
Through-Hole Layout Structure Including First and Second Pairs of Differential Signal Through-Holes Disposed Between Three Ground Through-Holes
Patent: 9,338,879 →
Application: 14/534,170 →
Publication: US 2016/0021735
Pin Arrangement and Electronic Assembly
Patent: 9,444,165 →
Application: 14/551,094 →
Publication: US 2016/0079694
Phase Detecting Apparatus and Phase Adjusting Method
Patent: 9,419,783 →
Application: 14/735,156 →
Slicer Apparatus and Calibration Method Thereof
Patent: 9,654,315 →
Application: 14/990,799 →
Publication: US 2017/0070373
Output Buffer Apparatus for Controlling Rate of Rising/Falling Edge of Buffered Signal
Patent: 9,559,676 →
Application: 14/993,104 →
Paddle Card and Plug-Cable Assembly
Application: 15/092,616 →
Publication: US 2017/0062991
Paddle Card and Plug-Cable Assembly
Application: 15/640,599 →
Publication: US 2018/0138639
High-Speed Internal Hysteresis Comparator
Application: 15/921,682 →
Start-Up Apparatus for Battery Management Circuit and Battery Management System Having the Same
Application: 16/006,851 →
Publication: US 2019/0123572
Related Assignments (13)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Sep 24, 2009
From: LEE, SHENG-YUAN
To: VIA TECHNOLOGIES, INC.
Reel/Frame 023281/0724 →
Assignment of Assignor's Interest Sep 17, 2012
From: LEE, SHENG-YUAN
To: VIA TECHNOLOGIES, INC.
Reel/Frame 028966/0634 →
Assignment of Assignor's Interest Jun 7, 2013
From: CHUNG, MING-HAN
To: VIA TECHNOLOGIES, INC.
Reel/Frame 030563/0778 →
Assignment of Assignor's Interest Sep 10, 2013
From: SHEN, HUNG-HAO; WANG, WEI-YU
To: VIA TECHNOLOGIES, INC.
Reel/Frame 031169/0399 →
Assignment of Assignor's Interest Nov 6, 2014
From: LEE, SHENG-YUAN
To: VIA TECHNOLOGIES, INC.
Reel/Frame 034112/0656 →
Assignment of Assignor's Interest Nov 25, 2014
From: LEE, SHENG-YUAN
To: VIA TECHNOLOGIES, INC.
Reel/Frame 034255/0260 →
Assignment of Assignor's Interest Jun 16, 2015
From: WANG, WEI-YU; YING, CHENG-MING
To: VIA TECHNOLOGIES, INC.
Reel/Frame 035847/0941 →
Assignment of Assignor's Interest Jan 12, 2016
From: WEI, YU-CHUNG
To: VIA TECHNOLOGIES, INC.
Reel/Frame 037457/0337 →
Assignment of Assignor's Interest Jan 15, 2016
From: HSIEH, MING-YU
To: VIA TECHNOLOGIES, INC.
Reel/Frame 037496/0671 →
Assignment of Assignor's Interest Apr 12, 2016
From: LEE, SHENG-YUAN
To: VIA TECHNOLOGIES, INC.
Reel/Frame 038249/0085 →
Assignment of Assignor's Interest Jul 3, 2017
From: LEE, SHENG-YUAN
To: VIA TECHNOLOGIES, INC.
Reel/Frame 042881/0330 →
Assignment of Assignor's Interest Mar 15, 2018
From: WANG, WEI-YU; WEI, YU-CHUNG
To: VIA TECHNOLOGIES, INC.
Reel/Frame 045215/0596 →
Assignment of Assignor's Interest Jun 13, 2018
From: WANG, TZE-SHIANG
To: VIA TECHNOLOGIES, INC.
Reel/Frame 046064/0142 →