Through-hole layout structure including first and second pairs of differential signal through-holes disposed between three ground through-holes
A through-hole layout structure is suitable for a circuit board. The through-hole layout structure includes a pair of first differential through-holes, a pair of second differential through-holes, a first ground through-hole, a second ground through-hole, and a third ground through-hole, which are all arranged on a first line. The first ground through-hole is located between the pair of first differential through-holes and the pair of second differential through-holes. The pair of first differential through-holes is located between the first ground through-hole and the second ground through-hole. The pair of second differential through-holes is located between the first ground through-hole and the third ground through-hole.
1. A through-hole layout structure, suitable for a circuit board, the through-hole layout structure comprising:
a pair of first differential through-holes arranged on a first line;
a pair of second differential through-holes arranged on the first line;
a first ground through-hole arranged on the first line, wherein the first ground through-hole is located between the pair of first differential through-holes and the pair of second differential through-holes;
a second ground through-hole arranged on the first line, wherein the pair of first differential through-holes is located between the first ground through-hole and the second ground through-hole; and
a third ground through-hole arranged on the first line, wherein the pair of second differential through-holes is located between the first ground through-hole and the third ground through-hole.
2. The through-hole layout structure of claim 1 , wherein the pair of first differential through-holes electrically references the first ground through-hole and the second ground through-hole, the pair of second differential through-holes electrically references the first ground through-hole and the third ground through-hole, and the second ground through-hole and the third ground through-hole do not provide plugging of a pin of an electrical connector.
3. The through-hole layout structure of claim 1 , further comprising:
a pair of third differential through-holes arranged on a second line substantially parallel to the first line;
a power through-hole arranged on the second line; and
a fourth ground through-hole arranged on the second line, wherein the pair of third differential through-holes is located between the power through-hole and the fourth ground through-hole.
4. The through-hole layout structure of claim 3 , wherein the pair of first differential through-holes transmits a pair of transmission differential signals Tx+ and Tx− on a first USB 3.0 or on a first USB 3.1, the pair of second differential through-holes transmits a pair of transmission differential signals Rx+ and Rx− on a second USB 3.0 or on a second USB 3.1, and the pair of third differential through-holes transmits a pair of transmission/reception differential signals D+ and D− on an USB 1.0 or on an USB 2.0.
5. The through-hole layout structure of claim 1 , further comprising:
a pair of third differential through-holes;
a power through-hole arranged on a second line substantially parallel to the first line with one of the pair of third differential through-holes arranged on the second line; and
a fourth ground through-hole arranged on a third line substantially parallel to the first line with the other one of the pair of third differential through-holes arranged on the third line.
6. The through-hole layout structure of claim 5 , wherein the pair of first differential through-holes transmits a pair of transmission differential signals Tx+ and Tx− on a first USB 3.0 or on a first USB 3.1, the pair of second differential through-holes transmits a pair of transmission differential signals Rx+ and Rx− on a second USB 3.0 or on a second USB 3.1, and the pair of third differential through-holes transmits a pair of transmission/reception differential signals D+ and D− on an USB 1.0 or on an USB 2.0.
7. A circuit board, suitable for installing an electrical connector, the circuit board comprising:
a plurality of patterned conductive layers;
a plurality of dielectric layers alternately stacked with the plurality of patterned conductive layers; and
a through-hole layout structure, comprising:
a pair of first differential through-holes arranged on a first line of the plurality of patterned conductive layers;
a pair of second differential through-holes arranged on the first line;
a first ground through-hole arranged on the first line, wherein the first ground through-hole is located between the pair of first differential through-holes and the pair of second differential through-holes;
a second ground through-hole arranged on the first line, wherein the pair of first differential through-holes is located between the first ground through-hole and the second ground through-hole; and
a third ground through-hole arranged on the first line, wherein the pair of second differential through-holes is located between the first ground through-hole and the third ground through-hole.
8. The circuit board of claim 7 , wherein the pair of first differential through-holes electrically references the first ground through-hole and the second ground through-hole, the pair of second differential through-holes electrically references the first ground through-hole and the third ground through-hole, and the second ground through-hole and the third ground through-hole do not provide plugging of a pin of the electrical connector.
9. The circuit board of claim 7 , wherein the through-hole layout structure further comprises:
a pair of third differential through-holes arranged on a second line of the plurality of patterned conductive layers substantially parallel to the first line;
a power through-hole arranged on the second line; and
a fourth ground through-hole arranged on the second line, wherein the pair of third differential through-holes is located between the power through-hole and the fourth ground through-hole.
10. The circuit board of claim 9 , wherein the pair of first differential through-holes transmits a pair of transmission differential signals Tx+ and Tx− on a first USB 3.0 or on a first USB 3.1, the pair of second differential through-holes transmits a pair of transmission differential signals Rx+ and Rx− on a second USB 3.0 or on a second USB 3.1, and the pair of third differential through-holes transmits a pair of transmission/reception differential signals D+ and D− on an USB 1.0 or on an USB 2.0.
11. The circuit board of claim 7 , wherein the through-hole layout structure further comprises:
a pair of third differential through-holes;
a power through-hole arranged on a second line of the plurality of patterned conductive layers substantially parallel to the first line and with one of the pair of third differential through-holes arranged on the second line; and
a fourth ground through-hole arranged on a third line of the plurality of patterned conductive layers substantially parallel to the first line and with the other one of the pair of third differential through-holes arranged on the third line.
12. The circuit board of claim 11 , wherein the pair of first differential through-holes transmits a pair of transmission differential signals Tx+ and Tx− on a first USB 3.0 or on a first USB 3.1, the pair of second differential through-holes transmits a pair of transmission differential signals Rx+ and Rx− on a second USB 3.0 or on a second USB 3.1, and the pair of third differential through-holes transmits a pair of transmission/reception differential signals D+ and D− on an USB 1.0 or on an USB 2.0.
13. An electronic assembly, comprising:
a circuit board, comprising:
a plurality of patterned conductive layers;
a plurality of dielectric layers alternately stacked with the plurality of patterned conductive layers; and
a through-hole layout structure, comprising:
a pair of first differential through-holes arranged on a first line of the plurality of patterned conductive layers;
a pair of second differential through-holes arranged on the first line;
a first ground through-hole arranged on the first line, wherein the first ground through-hole is located between the pair of first differential through-holes and the pair of second differential through-holes;
a second ground through-hole arranged on the first line, wherein the pair of first differential through-holes is located between the first ground through-hole and the second ground through-hole; and
a third ground through-hole arranged on the first line, wherein the pair of second differential through-holes is located between the first ground through-hole and the third ground through-hole; and
an electrical connector installed on the circuit board, the electrical connector comprising:
a pair of first differential pins respectively plugged into the pair of first differential through-holes;
a pair of second differential pins respectively plugged into the pair of second differential through-holes; and
a first ground pin plugged into the first ground through-hole.
14. The electronic assembly of claim 13 , wherein the pair of first differential through-holes electrically references the first ground through-hole and the second ground through-hole, the pair of second differential through-holes electrically references the first ground through-hole and the third ground through-hole, and the second ground through-hole and the third ground through-hole do not provide plugging of a pin of the electrical connector.
15. The electronic assembly of claim 13 , wherein the through-hole layout structure further comprises:
a pair of third differential through-holes arranged on a second line of the plurality of patterned conductive layers substantially parallel to the first line;
a power through-hole arranged on the second line; and
a fourth ground through-hole arranged on the second line, wherein the pair of third differential through-holes is located between the power through-hole and the fourth ground through-hole, and the electrical connector further comprises:
a pair of third differential pins respectively plugged into the pair of third differential through-holes;
a power pin plugged into the power through-hole; and
a second ground pin plugged into the fourth ground through-hole.
16. The electronic assembly of claim 15 , wherein the pair of first differential through-holes transmits a pair of transmission differential signals Tx+ and Tx− on a first USB 3.0 or on a first USB 3.1, the pair of second differential through-holes transmits a pair of transmission differential signals Rx+ and Rx− on a second USB 3.0 or on a second USB 3.1, and the pair of third differential through-holes transmits a pair of transmission/reception differential signals D+ and D− on an USB 1.0 or on an USB 2.0.
17. The electronic assembly of claim 15 , wherein the second ground through-hole and the third ground through-hole are overlapped on an orthographic projection of the electrical connector on the circuit board.
18. The electronic assembly of claim 13 , wherein the through-hole layout structure further comprises:
a pair of third differential through-holes;
a power through-hole arranged on a second line of the plurality of patterned conductive layers substantially parallel to the first line and with one of the pair of third differential through-holes arranged on the second line; and
a fourth ground through-hole arranged on a third line of the plurality of patterned conductive layers substantially parallel to the first line and with the other one of the pair of third differential through-holes arranged on the third line, and the electrical connector further comprises:
a pair of third differential pins respectively plugged into the pair of third differential through-holes;
a power pin plugged into the power through-hole; and
a second ground pin plugged into the fourth ground through-hole.
19. The electronic assembly of claim 18 , wherein the pair of first differential through-holes transmits a pair of transmission differential signals Tx+ and Tx− on a first USB 3.0 or on a first USB 3.1, the pair of second differential through-holes transmits a pair of transmission differential signals Rx+ and Rx− on a second USB 3.0 or on a second USB 3.1, and the pair of third differential through-holes transmits a pair of transmission/reception differential signals D+ and D− on an USB 1.0 or on an USB 2.0.
20. The electronic assembly of claim 18 , wherein the second ground through-hole and the third ground through-hole are not overlapped on an orthographic projection of the electrical connector on the circuit board.
21. The electronic assembly of claim 13 , wherein the electrical connector is suitable for plugging a wireless module, and an operating frequency of the wireless module is substantially the same as a clock frequency of a signal transmitted by the pair of first differential through-holes or the pair of second differential through-holes.