Patent Assignment
Reel/Frame 034112/0656
Assignment of Assignor's Interest
Recorded: 2014-11-06
Pages: 4
Assignor
LEE, SHENG-YUAN
Executed: 2014-11-03
Assignee
VIA TECHNOLOGIES, INC.
8F, 533, ZHONGZHENG RD., XINDIAN DIST.,, NEW TAIPEI CITY, 231, TAIWAN
Covered Property
(1)
Through-Hole Layout Structure Including First and Second Pairs of Differential Signal Through-Holes Disposed Between Three Ground Through-Holes
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.