Patent Assignment
Reel/Frame 023298/0924
Assignment of Assignor's Interest
Recorded: 2009-09-29
Pages: 4
Assignors
HUEMOELLER, RONALD PATRICK
Executed: 2009-09-24
DUNLAP, BRETT
Executed: 2009-09-28
HINER, DAVID JON
Executed: 2009-09-24
Assignee
AMKOR TECHNOLOGY, INC.
1900 SOUTH PRICE ROAD, CHANDLER, ARIZONA, 85286-6604
Covered Property
(1)
Shielded Embedded Electronic Component Substrate Fabrication Method and Structure
Patent:
8,432,022 →
Application:
12/569,300 →
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Patent Security Agreement
May 7, 2015
From: AMKOR TECHNOLOGY, INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 035613/0592 →
Security Interest
Aug 1, 2018
From: AMKOR TECHNOLOGY, INC.
To: BANK OF AMERICA, N.A., AS AGENT
Reel/Frame 046683/0139 →
Assignment of Assignor's Interest
Oct 9, 2020
From: AMKOR TECHNOLOGY, INC.
To: AMKOR TECHNOLOGY SINGAPORE HOLDING PTE.LTD.
Reel/Frame 054067/0135 →