Patent Assignment
Reel/Frame 023349/0570
Assignment of Assignor's Interest
Recorded: 2009-10-08
Pages: 2
Assignee
LG SEMICON CO., LTD.
1, HYANGJEONG-DONG, HUNGDUK-GO, CHEONGJU, CHOONGCHEONGBUK-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Mosfet and Fabrication Method Thereof
Related Assignments
(7)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name
Nov 1, 2004
From: HYUNDAI ELECTRONICS INDUSTRIES CO., LTD.
To: HYNIX SEMICONDUCTOR INC.
Reel/Frame 015320/0529 →
Security Interest
Mar 25, 2005
From: MAGNACHIP SEMICONDUCTOR, LTD.
To: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL TRUSTEE
Reel/Frame 016470/0530 →
Assignment of Assignor's Interest
Apr 29, 2009
From: HYNIX SEMICONDUCTOR INC.
To: MAGNACHIP SEMICONDUCTOR, LTD.
Reel/Frame 022678/0284 →
Assignment of Assignor's Interest
Apr 29, 2009
From: HYNIX SEMICONDUCTOR INC.
To: MAGNACHIP SEMICONDUCTOR, LTD.
Reel/Frame 022668/0894 →
Assignment of Assignor's Interest
May 30, 2009
From: MAGNACHIP SEMICONDUCTOR, LTD.
To: CROSSTEK CAPITAL, LLC
Reel/Frame 022764/0270 →
Partial Release of Security Interest
May 30, 2009
From: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL TRUSTEE
To: MAGNACHIP SEMICONDUCTOR, LTD.
Reel/Frame 022746/0870 →
Assignment of Assignor's Interest
Aug 12, 2009
From: CROSSTEK CAPITAL, LLC
To: CHUNG CHENG HOLDINGS, LLC
Reel/Frame 023085/0877 →