Patent Assignment
Reel/Frame 023381/0784
Assignment of Assignor's Interest
Recorded: 2009-10-16
Pages: 3
Assignors
FUJIMOTO, DAISUKE
Executed: 2009-10-02
MIZUNO, YASUYUKI
Executed: 2009-10-02
DANJOUBARA, KAZUTOSHI
Executed: 2009-10-02
MURAI, HIKARI
Executed: 2009-10-02
Assignee
HITACHI CHEMICAL COMPANY, LTD.
1-1, NISHI-SHINJUKU 2-CHOME, SHINJUKU-KU,, TOKYO, 163-0449, JAPAN
Covered Property
(1)
Process for Producing Resin Varnish Containing Semi-Ipn Composite Thermosetting Resin and, Provided Using the Same, Resin Varnish for Printed Wiring Board, Prepreg and Metal-Clad Laminate
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Notice of Change of Address of Assignee
Feb 14, 2013
From: HITACHI CHEMICAL COMPANY, LTD.
To: HITACHI CHEMICAL COMPANY, LTD.
Reel/Frame 029816/0583 →
Change of Name
Mar 2, 2023
From: HITACHI CHEMICAL COMPANY, LTD.
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 062917/0865 →
Change of Name
Mar 3, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 062946/0125 →
Change of Address
Feb 14, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066599/0037 →