Patent Assignment
Reel/Frame 029816/0583
Notice of Change of Address of Assignee
Recorded: 2013-02-14
Pages: 3
Assignor
HITACHI CHEMICAL COMPANY, LTD.
Executed: 2013-02-14
Assignee
HITACHI CHEMICAL COMPANY, LTD.
9-2, MARUNOUCHI 1-CHOME, CHIYODA-KU, TOKYO, 100-6606, JAPAN
Covered Property
(1)
Process for Producing Resin Varnish Containing Semi-Ipn Composite Thermosetting Resin and, Provided Using the Same, Resin Varnish for Printed Wiring Board, Prepreg and Metal-Clad Laminate
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Oct 16, 2009
From: FUJIMOTO, DAISUKE; MIZUNO, YASUYUKI; DANJOUBARA, KAZUTOSHI; MURAI, HIKARI
To: HITACHI CHEMICAL COMPANY, LTD.
Reel/Frame 023381/0784 →
Change of Name
Mar 2, 2023
From: HITACHI CHEMICAL COMPANY, LTD.
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 062917/0865 →
Change of Name
Mar 3, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 062946/0125 →
Change of Address
Feb 14, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066599/0037 →