Patent Assignment
Reel/Frame 023431/0357
Assignment of Assignor's Interest
Recorded: 2009-10-27
Pages: 8
Assignors
KANG, PIL-KYU
Executed: 2009-07-01
KIM, JUNG-HO
Executed: 2009-07-01
LEE, JONG-WOOK
Executed: 2009-07-01
CHOI, SEUNG-WOO
Executed: 2009-07-01
BAE, DAE-LOK
Executed: 2009-07-01
Assignee
SAMSUNG ELECTRONICS CO., LTD.
416 MAETAN-DONG, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Stacked Integrated Circuit Packages That Include Monolithic Conductive Vias