Assignment of Assignor's Interest

Recorded: 2009-10-19 Pages: 3

Assignors

SATO, YUKO

Executed: 2009-10-13

MAEDA, TAKEHIKO

Executed: 2009-10-13

KAWASHIRO, FUMIYOSHI

Executed: 2009-10-13

Assignee

NEC ELECTRONICS CORPORATION

1753 SHIMONUMABE, NAKAHARA-KU, KAWASAKI, KANAGAWA, 211-8668, JAPAN

Covered Property (1)

Method for manufacturing a semiconductor device having a heat spreader

Application: 12/588,542 →

Publication: US 2010/0105170

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.