Method for manufacturing a semiconductor device having a heat spreader

1 . A semiconductor device manufacturing method, comprising:

cutting a resin sealing body into a plurality of pieces, the resin sealing body comprising a plurality of semiconductor chips mounted on a wiring board, a heat spreader disposed above the plurality of the semiconductor chips, and sealing resin filled between the wiring board and the heat spreader,

wherein the cutting the resin sealing body includes:

shaving the resin sealing body from a side of the heat spreader; and

shaving the resin sealing body from a side of the wiring board.

2 . The method according to claim 1 ,

wherein the heat spreader is made of metal.

3 . The method according to claim 2 ,

wherein the shaving the resin sealing body from the side of the heat spreader includes shaving the resin sealing body with use of a first blade.

4 . The method according to claim 3 ,

wherein the heat spreader is completely cut off in the shaving the resin sealing body from the side of the heat spreader.

5 . The method according to claim 4 ,

wherein a width of a groove to be formed by the shaving the resin sealing body from the side of the heat spreader is wider than a width of a groove to be formed by the shaving the resin sealing body from the side of the wiring board.

6 . The method according to claim 4 ,

wherein the first blade has a pointed end.

7 . The method according to claim 4 ,

wherein the first blade has a rounded end.

8 . The method according to claim 3 ,

wherein the shaving the resin sealing body from the side of the wiring board includes shaving the resin sealing body with use of a second blade.

9 . The method according to claim 8 ,

wherein the first blade has rougher abrasive grains than abrasive grains of the second blade.

10 . The method according to claim 2 ,

wherein the shaving the resin sealing body from the side of the heat spreader includes etching the heat spreader.

11 . The method according to claim 10 ,

wherein the heat spreader is divided by etching in the etching the heat spreader.

12 . The method according to claim 10 ,

wherein a width of a groove to be formed by the shaving the resin sealing body from the side of the heat spreader is wider than a width of a groove to be formed by the shaving from the side of the wiring board.

13 . The method according to claim 10 ,

wherein the shaving the resin sealing body from the side of the wiring board includes the shaving the resin sealing body with use of a second blade.

14 . The method according to claim 2 ,

wherein the shaving the resin sealing body from the side of the wiring board is carried out after the shaving from the side of the heat spreader and the resin sealing body is cut off by the shaving from the side of the wiring board.

15 . The method according to claim 2 , further comprising:

a step of mounting a group of ball-like electrodes between the shaving from the side of the heat spreader and the shaving from the side of the wiring board.

16 . The method according to claim 2 , further comprising:

mounting a group of ball-like electrodes at the back side of the wiring board in prior to the shaving from the side of the wiring board and the shaving from the side of the heat spreader.

17 . The method according to claim 2 ,

wherein the surface of the heat spreader is covered by a film.

18 . The method according to claim 1 , further comprising:

forming the resin sealing body in prior to the cutting the resin sealing body,

wherein the forming the resin sealing body includes:

mounting the plurality of the semiconductor chips on a principal surface of the wiring board;

disposing the heat spreader above the plurality of the semiconductor chips; and

sealing the plurality of the semiconductor chips with the sealing resin supplied between the heat spreader and the wiring board, thereby forming the resin sealing body.