Patent Assignment
Reel/Frame 023477/0835
Assignment of Assignor's Interest
Recorded: 2009-11-05
Pages: 3
Assignee
CHARTERED SEMICONDUCTOR MANUFACTURING LTD.
60 WOODLANDS INDUSTRIAL PARK D, STREET 2, SINGAPORE 738406, SINGAPORE
Covered Property
(1)
Integrated Circuit Packaging System with Core Region and Bond Pad and Method of Manufacture Thereof
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name
Mar 16, 2010
From: CHARTERED SEMICONDUCTOR MANUFACTURING LTD.
To: CHARTERED SEMICONDUCTOR MANUFACTURING PTE. LTD.
Reel/Frame 024087/0589 →
Change of Name
Mar 16, 2010
From: CHARTERED SEMICONDUCTOR MANUFACTURING PTE. LTD.
To: GLOBALFOUNDRIES SINGAPORE PTE. LTD.
Reel/Frame 024088/0280 →
Security Agreement
Nov 27, 2018
From: GLOBALFOUNDRIES SINGAPORE PTE. LTD.
To: WILMINGTON TRUST, NATIONAL ASSOCIATION
Reel/Frame 047660/0203 →
Release of Security Interest
Nov 19, 2020
From: WILMINGTON TRUST, NATIONAL ASSOCIATION
To: GLOBALFOUNDRIES SINGAPORE PTE. LTD.
Reel/Frame 054481/0673 →