Integrated circuit packaging system with core region and bond pad and method of manufacture thereof

1. A method of manufacture of an integrated circuit packaging system comprising:

providing a semiconductor substrate;

forming a core region on the semiconductor substrate with the core region having a core side;

forming an inner bond pad on the semiconductor substrate with the inner bond pad having an inner core pad and an inner probe pad with the inner probe pad further from the core region than the inner core pad; and

forming an outer bond pad on the semiconductor substrate and adjacent the inner bond pad with the outer bond pad having an outer core pad and an outer probe pad with the outer probe pad closer to the core region than the outer core pad, the inner core pad between the outer probe pad and the core side, and the inner probe pad and the outer probe pad aligned in a row parallel to the core side.

2. The method as claimed in claim 1 wherein forming the outer bond pad includes forming the outer bond pad having a bond pad width and a pad pitch between the inner bond pad and the outer bond pad is approximately half of the bond pad width.

3. The method as claimed in claim 1 wherein:

forming the inner bond pad includes forming an inner abutment portion with the inner probe pad therein; and

forming the outer bond pad includes forming an outer abutment portion with the outer probe pad therein and the outer abutment portion facing the inner abutment portion.

4. The method as claimed in claim 1 wherein:

forming the inner bond pad includes:

forming the inner core pad having an inner core pad center, and

forming the inner probe pad having an inner probe pad center with the inner core pad center and the inner probe pad center aligned perpendicular to the core side; and

forming the outer bond pad includes:

forming the outer core pad having an outer core pad center, and

forming the outer probe pad having an outer probe pad center with the outer core pad center and the outer probe pad center aligned perpendicular to the core side.

5. The method as claimed in claim 1 wherein:

forming the inner bond pad includes:

forming the inner core pad having an inner core pad center, and

forming the inner probe pad having an inner probe pad center with the inner core pad center and the inner probe pad center not aligned perpendicular to the core side; and

forming the outer bond pad includes:

forming the outer core pad having an outer core pad center, and

forming the outer probe pad having an outer probe pad center with the outer core pad center and the outer probe pad center not aligned perpendicular to the core side.

6. A method of manufacture of an integrated circuit packaging system comprising:

providing a semiconductor substrate;

forming a core region on the semiconductor substrate with the core region having a core side;

forming an inner bond pad outside the core region and on the semiconductor substrate with the inner bond pad having an inner core pad, an inner probe pad further from the core region than the inner core pad, and an inner abutment portion; and

forming an outer bond pad outside the core region and on the semiconductor substrate with the outer bond pad having an outer core pad, an outer probe pad closer to the core region than the outer core pad, the inner core pad between the outer probe pad and the core side, and an outer abutment portion adjacent the inner abutment portion with the inner probe pad and the outer probe pad aligned in a row parallel to the core side.

7. The method as claimed in claim 6 wherein forming the outer bond pad includes forming the outer probe pad within the outer abutment portion.

8. The method as claimed in claim 6 wherein forming the inner bond pad includes forming the inner probe pad within the inner abutment portion.

9. The method as claimed in claim 6 wherein forming the outer bond pad includes forming the outer abutment portion facing the inner abutment portion.

10. The method as claimed in claim 6 wherein forming the outer bond pad includes forming the outer abutment portion symmetrical to the inner abutment portion.

11. An integrated circuit packaging system comprising:

a semiconductor substrate;

a core region on the semiconductor substrate with the core region having a core side;

an inner bond pad on the semiconductor substrate with the inner bond pad having an inner core pad and an inner probe pad with the inner probe pad further from the core region than the inner core pad; and

an outer bond pad on the semiconductor substrate and adjacent the inner bond pad with the outer bond pad having an outer core pad and an outer probe pad with the outer probe pad closer to the core region than the outer core pad, the inner core pad between the outer probe pad and the core side, and the inner probe pad and the outer probe pad aligned in a row parallel to the core side.

12. The system as claimed in claim 11 wherein the outer bond pad includes the outer bond pad having a bond pad width and a pad pitch between the inner bond pad and the outer bond pad is approximately half of the bond pad width.

13. The system as claimed in claim 11 wherein:

the inner bond pad includes an inner abutment portion with the inner probe pad therein; and

the outer bond pad includes an outer abutment portion with the outer probe pad therein and the outer abutment portion facing the inner abutment portion.

14. The system as claimed in claim 11 wherein:

the inner bond pad includes:

the inner core pad having an inner core pad center, and

the inner probe pad having an inner probe pad center with the inner core pad center and the inner probe pad center aligned perpendicular to the core side; and

the outer bond pad includes:

the outer core pad having an outer core pad center, and

the outer probe pad having an outer probe pad center with the outer core pad center and the outer probe pad center aligned perpendicular to the core side.

15. The system as claimed in claim 11 wherein:

the inner bond pad includes:

the inner core pad having an inner core pad center, and

the inner probe pad having an inner probe pad center with the inner core pad center and the inner probe pad center not aligned perpendicular to the core side; and

the outer bond pad includes:

the outer core pad having an outer core pad center, and

the outer probe pad having an outer probe pad center with the outer core pad center and the outer probe pad center not aligned perpendicular to the core side.

16. The system as claimed in claim 11 wherein:

the inner bond pad includes the inner bond pad outside the core region, the inner bond pad having an inner abutment portion; and

the outer bond pad includes the outer bond pad outside the core region, the outer bond pad having an outer abutment portion adjacent the inner abutment portion.

17. The system as claimed in claim 16 wherein the outer bond pad includes the outer probe pad within the outer abutment portion.

18. The system as claimed in claim 16 wherein the inner bond pad includes the inner probe pad within the inner abutment portion.

19. The system as claimed in claim 16 wherein the outer bond pad includes the outer abutment portion facing the inner abutment portion.

20. The system as claimed in claim 16 wherein the outer bond pad includes the outer abutment portion symmetrical to the inner abutment portion.