IP Library › Assignment 023506/0280
Patent Assignment
Reel/Frame 023506/0280

Assignment of Assignor's Interest

Recorded: 2009-11-12 Pages: 4
Assignors
ISOGAI, HIROMICHI
Executed: 2009-10-29
SENDA, TAKESHI
Executed: 2009-10-29
TOYODA, EIJI
Executed: 2009-10-29
MURAYAMA, KUMIKO
Executed: 2009-10-29
IZUNOME, KOJI
Executed: 2009-10-29
MAEDA, SUSUMU
Executed: 2009-10-29
KASHIMA, KAZUHIKO
Executed: 2009-10-29
Assignee
COVALENT MATERIALS CORPORATION
6-3, OHSAKI 1-CHOME, SHINAGAWA-KU, TOKYO, 141-0032, JAPAN
Covered Property (1)
Manufacturing Method for Silicon Wafer
Patent: 7,977,219 →
Application: 12/512,229 →
Publication: US 2010/0055884
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Mar 11, 2013
From: COVALENT MATERIALS CORPORATION
To: COVALENT SILICON CORPORATION
Reel/Frame 029962/0497 →
Change of Name Mar 13, 2013
From: COVALENT SILICON CORPORATION
To: GLOBALWAFERS JAPAN CO., LTD.
Reel/Frame 029991/0421 →