Patent Assignment
Reel/Frame 023510/0538
Assignment of Assignor's Interest
Recorded: 2009-11-13
Pages: 24
Assignor
CREDENCE SYSTEMS CORPORATION
Executed: 2008-02-20
Assignee
DCG SYSTEMS, INC.
45900 NORTHPORT LOOP EAST, FREMONT, CALIFORNIA, 94538
Covered Property
(1)
Method for Global Die Thinning and Polishing of Flip-Chip Packaged Integrated Circuits