Patent Assignment
Reel/Frame 023517/0416
Assignment of Assignor's Interest
Recorded: 2009-11-13
Pages: 2
Assignors
LIN, CHUAN-YI
Executed: 2009-01-15
HAO, CHING-CHEN
Executed: 2009-01-15
CHOU, CHEN CHENG
Executed: 2009-01-15
LIN, SHENG-YUAN
Executed: 2009-01-15
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Forming Seal Ring in an Integrated Circuit Die