Patent Assignment
Reel/Frame 023637/0494
Assignment of Assignor's Interest
Recorded: 2009-11-30
Pages: 3
Assignor
SHINGAI, TADAYUKI
Executed: 2009-11-19
Assignee
NEC ELECTRONICS CORPORATION
1753 SHIMONUMABE, NAKAHARA-KU, KAWASAKI-SHI, KANAGAWA, 211-8668, JAPAN
Covered Property
(1)
Semiconductor package, method of manufacturing semiconductor package, electronic component, and method of manufacturing electronic component
Application:
12/591,729 →
Publication:
US 2010/0133349
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.