Semiconductor package, method of manufacturing semiconductor package, electronic component, and method of manufacturing electronic component

1 . A semiconductor package comprising:

a semiconductor chip;

a die pad being mounted with said semiconductor chip with a dielectric interposed and serving as an antenna; and

a sealing resin sealing said semiconductor chip and said die pad,

wherein a relative dielectric constant of said dielectric is higher than that of said sealing resin.

2 . The semiconductor package as set forth in claim 1 , further comprising a suspension lead connected to said die pad,

wherein said sealing resin seals said suspension lead.

3 . The semiconductor package as set forth in claim 1 , wherein said relative dielectric constant of said dielectric is equal to or more than 5 and equal to or less than 15.

4 . The semiconductor package as set forth in claim 1 , wherein the thickness of said dielectric is equal to or more than 300 μm and equal to or less than 900 μm.

5 . A semiconductor package comprising:

a first semiconductor chip;

a die pad being mounted with said first semiconductor chip with a dielectric interposed and serving as an antenna;

a suspension lead connected to said die pad;

a second semiconductor chip mounted on said suspension lead and storing an identifier; and

a sealing resin sealing said first and second semiconductor chips and said die pad,

wherein a relative dielectric constant of said dielectric is higher than that of said sealing resin.

6 . The semiconductor package as set forth in claim 5 , wherein said relative dielectric constant of said dielectric is equal to or more than 5 and equal to or less than 15.

7 . The semiconductor package as set forth in claim 5 , wherein the thickness of said dielectric is equal to or more than 300 μm and equal to or less than 900 μm.

8 . The semiconductor package as set forth in claim 5 , wherein said second semiconductor chip has a communication function.

9 . An electronic component comprising:

a mounting board; and

a semiconductor package mounted on said mounting board,

wherein said semiconductor package includes:

a semiconductor chip;

a die pad being mounted with said semiconductor chip with a dielectric interposed and serving as an antenna; and

a sealing resin sealing said semiconductor chip and said die pad, and

wherein a relative dielectric constant of said dielectric is higher than that of said sealing resin.

10 . An electronic component comprising:

a mounting board; and

a semiconductor package mounted on said mounting board,

wherein said semiconductor package includes:

a first semiconductor chip;

a die pad being mounted with said first semiconductor chip with a dielectric interposed and serving as an antenna;

a suspension lead connected to said die pad;

a second semiconductor chip mounted on said suspension lead and storing an identifier; and

a sealing resin sealing said first and second semiconductor chips and said die pad, and

wherein a relative dielectric constant of said dielectric is higher than that of said sealing resin.

11 . The electronic component as set forth in claim 10 , wherein said second semiconductor chip has a communication function.

12 . A method of manufacturing a semiconductor package, comprising:

mounting a semiconductor chip on a die pad serving as an antenna with a dielectric interposed; and

sealing said semiconductor chip and said die pad with a sealing resin,

wherein a relative dielectric constant of said dielectric is higher than that of said sealing resin.

13 . A method of manufacturing a semiconductor package, comprising:

preparing a die pad serving as an antenna and a suspension lead connected to said die pad;

mounting a first semiconductor chip on said die pad with a dielectric interposed;

mounting a second semiconductor chip storing an identifier on said suspension lead; and

sealing said first and second semiconductor chips and said die pad with a sealing resin,

wherein a relative dielectric constant of said dielectric is higher than that of said sealing resin.

14 . The method as set forth in claim 13 , further comprising giving a communication function to said second semiconductor chip.

15 . A method of manufacturing an electronic component, comprising:

preparing a mounting board; and

mounting a semiconductor package on said mounting board,

wherein said semiconductor package includes:

a semiconductor chip;

a die pad being mounted with said semiconductor chip with a dielectric interposed and serving as an antenna; and

a sealing resin sealing said semiconductor chip and said die pad, and

wherein a relative dielectric constant of said dielectric is higher than that of said sealing resin.

16 . A method of manufacturing an electronic component, comprising:

preparing a mounting board; and

mounting a semiconductor package on said mounting board,

wherein said semiconductor package includes:

a first semiconductor chip;

a die pad being mounted with said first semiconductor chip with a dielectric interposed and serving as an antenna;

a suspension lead connected to said die pad;

a second semiconductor chip mounted on said suspension lead and storing an identifier; and

a sealing resin sealing said first and second semiconductor chips and said die pad, and

wherein a relative dielectric constant of said dielectric is higher than that of said sealing resin.

17 . The method as set forth in claim 16 , wherein said second semiconductor chip has a communication function.