Patent Assignment
Reel/Frame 023643/0910
Assignment of Assignor's Interest
Recorded: 2009-12-11
Pages: 2
Assignee
TOKYO ELECTRON LIMITED
AKASAKA BIZ TOWER, 3-1 AKASAKA 5-CHOME, MINATO-KU, TOKYO, 107-6325, JAPAN
Covered Property
(1)
Method to Remove Capping Layer of Insulation Dielectric in Interconnect Structures