Patent Assignment
Reel/Frame 023689/0190
Assignment of Assignor's Interest
Recorded: 2009-12-22
Pages: 2
Assignor
DUDEK, VOLKER
Executed: 2009-11-30
Assignee
TELEFUNKEN SEMICONDUCTORS GMBH & CO. KG
THERESIENSTRASSE 2, HEILBRONN, 74072, GERMANY
Covered Property
(1)
Method for Manufacturing Components on an Soi Wafer
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.