IP Library Assignment 023724/0895
Patent Assignment
Reel/Frame 023724/0895

Assignment of Assignor's Interest

Recorded: 2009-12-31 Pages: 3
Assignor
FUJII, TATSUO
Executed: 2009-10-08
Assignee
COVALENT MATERIALS CORPORATION
2-1-32, EGUCHI, SHUNAN-SHI, YAMAGUCHI-KEN, JAPAN
Covered Property (1)
Method for Production of Silicon Wafer for Epitaxial Substrate and Method for Production of Epitaxial Substrate
Patent: 8,216,921 →
Application: 12/560,847 →
Publication: US 2010/0093156
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Mar 11, 2013
From: COVALENT MATERIALS CORPORATION
To: COVALENT SILICON CORPORATION
Reel/Frame 029962/0497 →
Change of Name Mar 13, 2013
From: COVALENT SILICON CORPORATION
To: GLOBALWAFERS JAPAN CO., LTD.
Reel/Frame 029991/0421 →