Assignment of Assignor's Interest

Recorded: 2010-01-14 Received: 2010-01-14 Pages: 385

Assignors

INFINEON TECHNOLOGIES AG

Executed: 2006-04-25

Executed: 2006-04-25

Assignee

QIMONDA AG

GUSTAV-HEINEMANN-RING 212, MUNICH, DEX, 81739, GERMANY

Covered Properties (6)

Method for Adjusting Processing Parameters of at Least One Plate-Shaped Object in a Processing Tool

Application: 10/694,594 →

Configuration and a Method for Reducing Contamination with Particles on a Substrate in a Process Tool

Application: 10/643,820 →

Method and Apparatus for Measuring and Controlling the Water Content of a Water-Containing Liquid Mixture

Application: 10/403,878 →

Semiconductor Wafer Pod

Application: 10/262,181 →

Method of Handling a Silicon Wafer

Application: 10/126,372 →

Method for Clamping a Semiconductor Device in a Manufacturing Process

Application: 10/112,271 →